solder
英 ['s??ld?; 's?ld?]
美['sɑd?]
- vi. 焊接
- vt. 焊接；使聯接在一起
- n. 焊料；接合物
實用場景例句
- Fewer workers are needed to solder circuit boards...
- 焊接電路板需要的工人更少了。
柯林斯高階英語詞典
- He then soldered the wire to the telephone terminal...
- 接著他把電話線焊接到電話機上。
柯林斯高階英語詞典
- We should the adhibit of solder paste before screen printing by automatic machine or by hand.
- 我們在進行錫膏印刷前應對錫膏進行一定的檢測.如果沒有專用設備也可以用以下的方法檢查一下.
期刊摘選
- PCBs are transported by a conveyor system over the preheat, solder and cooling stations.
- 電子線路板(PCB) 通過傳送系統經過預熱, 焊接和冷卻區域.
期刊摘選
- Used with the solder wire together, soldering a stainless steel etc metal.
- 同錫線一起使用, 焊接不銹鋼等難以上錫的金屬.
期刊摘選
- Interface void damage is the failure characteristic of solder joint under temperature cycling.
- 溫度循環載荷可以在焊點界面處形成足以導致空洞損傷發生的高應力三軸度.
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- Solder side is chosen to measure.
- 4量測以吃錫面為選擇點.
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- Do the supplies use magnifying glass to full check PCB solder connections?
- 供應商是否用放大鏡全面檢查PCB的焊點?
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- And techniques to make free solder bumping with electroplating are illustrated.
- 重點闡述了采用電鍍制作無鉛焊料凸點的方法.
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- Do not use any warming device to heat up the solder paste.
- 切忌用加熱工具對焊接材料進行加熱.
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- It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.
- 如果使用美國尼伯科管件,很容易學會進行完美的焊料連接.
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- Hand solder is recommended instead of reflow solder.
- 不建議使用回流焊,推薦使用手動焊接.
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- Then reheat the solder cup of the fitting to draw up the alloy.
- 然后重新加熱管件焊料杯口以吸入融合合金.
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- The second section will introduce the new slide valve and its application in Solder Paste process.
- 第二部分介紹最新的滑動閥科技及其在點錫膏中的應用.
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- Is the average and range of Solder Paste height measurements SPC controlled?
- 錫膏厚度測量的平均值和間距SPC是否受控?
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- Above two years solder sale experience.
- 兩年以上焊料銷售經驗.
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- Titanium alloy solder bath : suitable for lead – free solder.
- 防腐蝕鈦合金爐膽: 適用無鉛工藝,壽命長. (先配項)
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- No monitoring and control requirement on solder iron temperature.
- 對烙鐵溫度沒有要求監測及控制.
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- Oxide occurring after melting approximately 50 % less than common solder.
- 熔解后氧化物(錫渣)之發生量較一般焊錫減低近半.
期刊摘選
- Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
- 對錫膏厚度測量的平均值和間距是否定義了其控制上限和下限?
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- Careful tinning of the ends of wires results in a better joint when you solder them.
- 仔細對金屬絲末端進行包錫有助于它們在焊接時很好地結合.
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- The solder wire should attain the standard provision deflection and pitch by straightening.
- 焊絲經校直應達到標準規定的挺度和翹距.
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- Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.
- 理論模型也定量給出了焊膏厚度與焊點性能之間的關系.
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- Is the time recorded when the solder paster is taken out from the storage case?
- 焊貼從存儲環境取出時的時間是否有記錄?
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- If too much solder is used, it may flow past tube stop and clog sealing area.
- 如果使用的焊料太多, 那么有些焊料可能會流過管道阻擋部位,并堵塞密封區域.
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- Block incoming electrical solder joints with different samples!
- 來料電機座的焊點與樣品不同!
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- So it will result in rigidity skin & block and solder balls etc.
- 產生的后果是:錫膏出現硬皮 、 硬塊、難熔并產生大量錫球等.
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